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Started by ptashek, 10 January 2013, 02:56 PM
Quote from: ptashek on 22 July 2015, 10:41 PMHere's the final revision of the schematic, with all parts as they should be, and the entire ignition circuit shown. I'll add an Eagle schematic / PCB / BOM at some point, once my prototype is verified (parts are shipping!). Simulations show this'll work as expected https://www.circuitlab.com/circuit/5ag5z6/w116-ignition-control-circuit/ (https://www.circuitlab.com/circuit/5ag5z6/w116-ignition-control-circuit/)If you go and make a commercial gain out of this, I want 50%
Quote from: djenka018 on 04 September 2015, 08:21 AMI'll ask a question that may be overly stupid.I do not see your coil on the pictures. Is there one in the circuit?And the coil must be of the correct type (not capacitive discharge type like on D-Jets)
Quote from: djenka018 on 05 September 2015, 05:52 AMCongratulations!You've now reached the point where a FET may be the next fork (it can dramatically reduce the heat output).Most of the heat comes from the ripple following the inductive spike (snubber network helps there) and from the silicone transistor (faster switching = less heat, lower switching voltage etc.). It also affects the spark energy, similar to the way arcing of points reduces the spark energy (hence the tuning capacitor which kills the spark).
Quote from: djenka018 on 09 September 2015, 09:36 PMSend me the .sch file with SMD's and I will make you a PCB.I think I got Eagle and gEDA... I do not think you will be much better with SMD in terms of heat. Most the heat comes from power drive components and that are the 2 large transistors and surrounding components.
Quote from: djenka018 on 12 September 2015, 07:38 AMHere's corrected diagramme pdf and a PCB based on your own SMD components.Some components are undersized for the function and when you decide on exact component I can update the PCB.TO3 transistor (BU323) is meant to be on the other side of the PCB hence the overlaying components. Normally, this is separated further by about 5mm from the heat sink. Double sided metalised or riveted holes should be used for reliability of contacts.All the tracks surrounding BSV15 and north from it should not be covered with an overlay and when the pcb is flowed the solder should increase their thickness.
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